[TMF Implementation Case] Integrated Circuit Assembly Factory (Suzhou, China)
Essential treatment for the recycling and reuse of industrial wastewater! Introduction of TMF application examples.
Backgrinding and dicing are manufacturing processes for integrated circuits (ICs). In these processes, ultra-pure water is used to wash away fine silica particles and other substances that adhere to the wafers, resulting in industrial wastewater that is discharged. Typically, this wastewater contains ultra-pure water mixed with fine silica particles, but sometimes grinding fluid may also be present. The removal of these fine silica particles is an essential treatment for the recycling and reuse of this industrial wastewater, which is discharged in large volumes. We will verify that the introduction of this system is a suitable choice for the facility. [Implementation Site] ■ An integrated circuit assembly factory located in Suzhou, China *For more details, please refer to the PDF document or feel free to contact us.
- Company:アクアテクノロジー 環境事業部
- Price:Other